

Особенности:
- Low profile package
- Same power as standard SMB devices (600 W)
- For surface mounted applications to optimize board space
- 600W peak pulsepower capability at 10x1000µs waveform, repetition rate (duty cycle):0.01%
- Low inductance, excellent clamping capability Fast response time:typically less than 1.0ns from 0 Volts to VBR min
- Typical IR less than 1µA above 12V
- Built-in strain relief
- Glass passivated junction
- High temperature soldering: 260°C/10 seconds at terminals
- Typical maximum temperature coefficient ?VBR = 0.1% x VBR@25°C x ?T
- Plastic package has Underwriters Laboratory Flammability 94V-O
- Matte tin lead–free plated
- Halogen free and RoHS compliant
Применения:
Таблица параметров:
Catalog # | VR (Vso) | Watts (W) | IPP 10x1000μs (A) | MIN VBR@IT (V) |
MAX VBR@IT (V) |
Vc (V) | IT (mA) |
Ir@Vso (μA) |
Max Temp (° C) |
SMA6J12A | 12 | 600 | 30.2 | 13.3 | 14.7 | 19.9 | 1 | 1 | 150 |
SMA6J5.0A | 5 | 600 | 65.3 | 6.4 | 7 | 9.2 | 10 | 800 | 150 |